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Treffer 99936 von 4443493
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| Link zu diesem Datensatz | https://d-nb.info/1366138686 |
| Titel | Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration / by John Lau, Xuejun Fan |
| Person(en) |
Lau, John (Verfasser) Fan, Xuejun (Verfasser) |
| Organisation(en) | SpringerLink (Online service) (Sonstige) |
| Ausgabe | 1st ed. 2025 |
| Verlag | Singapore : Springer Nature Singapore, Imprint: Springer |
| Zeitliche Einordnung | Erscheinungsdatum: 2025 |
| Umfang/Format | Online-Ressource, XXIV, 645 p. 623 illus., 557 illus. in color. : online resource. |
| Andere Ausgabe(n) |
Printed edition:: ISBN: 978-981-9641-65-9 Printed edition:: ISBN: 978-981-9641-67-3 Printed edition:: ISBN: 978-981-9641-68-0 |
| Inhalt | Chiplet Design and Heterogeneous Integration Packaging -- Advanced Substrates for Chiplet and Heterogeneous Integration -- Cu-Cu Bumpless Hybrid Bonding -- Warpage Management in Semiconductor Packaging -- Simulation and Optimization of Thermal-Mechanical and Mechanical Reliability of Solder Joint -- Moisture Reliability, Failure Mechanisms and Moisture Diffusion Modeling -- Design Rules for Electromigration Failure -- Thermal Management |
| Persistent Identifier |
URN: urn:nbn:de:101:1-2505200405262.380443834157 DOI: 10.1007/978-981-96-4166-6 |
| URL | https://doi.org/10.1007/978-981-96-4166-6 |
| ISBN/Einband/Preis | 978-981-96-4166-6 |
| Sprache(n) | Englisch (eng) |
| DDC-Notation | 621.381 (maschinell ermittelte DDC-Kurznotation) |
| Sachgruppe(n) | 621.3 Elektrotechnik, Elektronik |
| Online-Zugriff | Archivobjekt öffnen |
Treffer 99936 von 4443493
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