|
231 |
A Theoretical Description of Elastic Pillar Substrates in Biophysical Experiments Enthalten in ChemPhysChem Bd. 6, 2005, Nr. 8: 1492-1498. 7 S.
|
|
|
232 |
Effect of Prior Fatigue Exposure on the Creep Behaviour of an Aluminium Alloy (Al-12Si-CuMgNi) Enthalten in International journal of materials research Bd. 91, 2000, Nr. 3: 190-195. 6 S.
|
|
|
233 |
Dispersion Strengthening of Disordered and Ordered Metallic Materials: From Dislocation Mechanisms to New Alloys/Dispersionshärtung von ungeordneten und geordneten metallischen Werkstoffen: Vom Versetzungsmechanismus zur neuen Legierung Dispersionshärtung, ein klassischer metallkundlicher Enthalten in International journal of materials research Bd. 87, 1996, Nr. 11: 874-884. 11 S.
|
|
|
234 |
Biegeexperimente an Mikrobalken Enthalten in Materials testing Bd. 38, 1996, Nr. 7-8: 326-329. 4 S.
|
|
|
235 |
Mechanisms of Powder Milling Investigated by X-ray Diffraction and Quantitative Metallography Enthalten in International journal of materials research Bd. 86, 1995, Nr. 12: 804-813. 10 S.
|
|
|
236 |
Electromigration failure by shape change of voids in bamboo lines Woodbury, NY : American Inst. of Physics, 1994
|
|
|
237 |
ODS-Legierungen: Abnormales Kornwachstum im Temperaturgradienten Enthalten in International journal of materials research Bd. 83, 1992, Nr. 6: 423-428. 6 S.
|
|
|
238 |
Microstructure and Phase Composition in High-Strength Aluminium Alloys Produced by A Splat-Cooling Technique/Gefüge und Phasenbestand in mit der Splat-Cooling-Technik hergestellten hochfesten Aluminium-Legierungen Enthalten in International journal of materials research Bd. 82, 1991, Nr. 7: 503-509. 7 S.
|
|
|
239 |
The Role of Grain Boundaries in High Temperature Creep Fracture of an Oxide Dispersion Strengthened Superalloy Enthalten in International journal of materials research Bd. 79, 1988, Nr. 12: 774-781. 8 S.
|
|
|
240 |
Sintermechanismen für die Intensivschwindung in einphasigen Systemen Enthalten in International journal of materials research Bd. 77, 1986, Nr. 4: 228-233. 6 S.
|
|